Bustaman, Tengku Elisa (1999) Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman. Masters thesis, University of Malaya.
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Official URL: http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01...
| Item Type: | Thesis (Masters) |
|---|---|
| Additional Information: | Dissertation (M.Tech. (Material Sc.)) -- Institut Pengajian Siswazah dan Penyelidikan, Universiti Malaya, 2001. |
| Uncontrolled Keywords: | Semiconductors. |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) |
| Divisions: | Institute of Graduate Studies |
| Depositing User: | Puan Marzulaila Johari |
| Date Deposited: | 19 Apr 2012 12:16 |
| Last Modified: | 19 Jul 2013 12:01 |
| URI: | http://studentsrepo.um.edu.my/id/eprint/2859 |
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