Effect of heat distribution and vibration on wider lead frame / Nurfarrahain Nadia Ahmad

Nurfarrahain Nadia, Ahmad (2019) Effect of heat distribution and vibration on wider lead frame / Nurfarrahain Nadia Ahmad. Masters thesis, University of Malaya.

[img] Image (JPEG) (The Candidate’s Agreement)
Restricted to Repository staff only

Download (706Kb)
    PDF (Thesis M.A)
    Download (2687Kb) | Preview


      Adoption of more electronic components in end products, the semiconductor industry is facing a challenge era that requires price management to achieve efficiency, high productivity and excellence with each of the diverse customers. One of the strategies is to enhance the wider of lead frame size for cost down reduction related on material and increase the productivity. However there are two main challenges of wider lead frame implementation which is heat distribution not even and vibration issue that will cause bonding performance no good. Heat distribution uneven is causing warpage due to heating principle at machine. High density unit per lead frame may contribute to warpage and it cannot be avoid. This issue can be improving by design consideration of dimple installation in order to release the material stress after applied heat. For vibration concern, upward floating lead on widen lead frame give potential of finger lead bouncing during bonding process, make the second bond ability become weak. As for future improvement, some modification on die-set stamping required to flatten the finger inner lead and reduce their vibration.

      Item Type: Thesis (Masters)
      Additional Information: Thesis (M.A.) - Faculty of Engineering, University of Malaya, 2019.
      Uncontrolled Keywords: Semiconductor industry; Wider of lead frame size; Heat distribution; Modification on die-set stamping
      Subjects: T Technology > TJ Mechanical engineering and machinery
      Divisions: Faculty of Engineering
      Depositing User: Mrs Rafidah Abu Othman
      Date Deposited: 17 Jun 2020 02:29
      Last Modified: 17 Jun 2020 02:29
      URI: http://studentsrepo.um.edu.my/id/eprint/11304

      Actions (For repository staff only : Login required)

      View Item