Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Siah, Meng Zhe (2019) Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe. Masters thesis, University Malaya.

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Abstract

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of V006A (4%,5%,6% and 7%) and the Al loading (10%, 20%, 30% and 40%) have been loaded into the Al-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure. The physical and electrical properties were investigated. X-ray diffraction results showed that Al2Cu and CuO phases were formed in sintered Al-Cu nanopaste. Overall, Al-Cu nanopaste with 5% V006A has exhibited the best electrical conductivity [21??.cm], lowest oxygen element [15.36%] and smallest crystallite size [8.15nm], which is suitable for high temperature electronic applications. Also, Al0.5-Cu4.5 demonstrated the lowest electrical resistivity at 21.70 ??.cm, which is acceptable for a high temperature die-attach material.

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